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Thermal Cycling Furnace
Thermal Cycling Furnace
Roller Hearth Furnace
Roller Hearth Furnace
Microwave Hybrid Heating System
Microwave Hybrid Heating System
Furnace
High Temperature Furnace.
Creep in Compression
Creep in Compression
 
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  • MOCVD
  • Specification
    The VBCC Metal organic chemical vapour deposition (MOCVD) Equipment is used to deposit very thin layers of atoms onto a semiconductor wafer or other substrate.
    • Three Heaters shall be provided
    • Substrate Temperatures up to 1100 °C
    • Wafer or Substrate Sizes 2", 4”
    • Showerhead Gas Delivery
    • DC Plasma: 1 KW, 1000/500 Volt, RF Plasma 600 W @13.56 MHz
    • Under Vacuum (1x10-6) or Controlled Atmosphere (Ar, N2) Operation
    • Semi Automatic Substrate Loading/Unloading System
    • 3 or more Mass Flow Controlled UHP Gas Lines
    • Swagelok B series, high temperature SS valve coupled at vapour delivery pipe line
     
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